The Pick&Place lines have a total production capacity of 80,000 components per hour and are among the most precise systems available on the market, while also ensuring high reliability.

Thanks to these machines, we are able to place components of various sizes with extremely high precision on even large-format boards.

Operational precision, rated at 4 sigma, ensures an extraordinary level of quality, while extremely accurate optical inspections allow us to immediately identify and reject any component that may have issues with external geometry or pins.

This attention to detail and quality represents our ongoing commitment to offering high-precision, reliable products to our customers.

The screen printing machines are equipped with a sophisticated 2D control system for paste deposition on the PCB, enabling the automatic application of solder paste with extreme precision. Once the operation is complete, the system performs a detailed electronic optical inspection to identify any areas that are not perfectly formed.

To prevent variations in paste deposition, the machines are programmed to clean the stencil after deposition using specialized solvents and an absorbent roller.

This automated process, combined with precision optical inspection, ensures uniform and accurate distribution of solder paste on the circuit boards, minimizing the risk of defects.

Constant and accurate monitoring of every stage of the paste application process ensures compliance with the highest quality standards and delivers reliable, high-quality end products to our customers.

This type of equipment and technique ensures uniform soldering thanks to differentiated heating profiles based on the specific area of the oven.

The oven consists of a conveyor belt that runs through a tunnel heated by forced hot-air convection, equipped with exhaust hoods to remove soldering fumes.

A custom profile is created for each board to ensure high-quality, reliable soldering throughout the production run, based on the board’s weight and the material of the printed circuit board.

The final reflow zone in the soldering process ensures that every area is properly soldered.

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This advanced soldering technique, also known as condensation soldering, is currently the leading solution on the market thanks to its ability to produce solder joints of the highest quality.

Consistent temperatures across the entire surface of the board, even with extremely uneven mass distribution, are one of the key strengths of this method.

This thermal uniformity, even in the presence of significant variations in mass distribution on the board, ensures a uniform and highly precise solder joint.

This level of constant thermal control is essential for achieving reliable results and high-quality standards in every finished product.

Thanks to this programmable machine, it is possible to check the position of each component based on a previously indexed file.

It is also possible to check the value and polarity of each component, whether the solder joints comply with previously defined standards, and for short circuits between pins and pads.

With this equipment, you can quickly perform an “X-ray” inspection of circuit boards to check the condition of the solder joints and identify defects on both the top and bottom sides.

This process is essential for BGA and QFN packages and for inspecting areas that are covered by other components.